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CSD25484F4 - Texas Instruments

Description: MOSFET -20-V, P channel NexFET™ power MOSFET, single LGA 0.6 mm x 1 mm, 109 mOhm, gate ESD protection 3-PICOSTAR -55 to 150

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CSD25484F4 - Texas Instruments PCB footprint - Other - Other - CSD25484F4-2
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CSD25484F4 - Texas Instruments  - 3D model - Other - CSD25484F4-2
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CSD25484F4 Details

  • Manufacturer Part Number:

    CSD25484F4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LGA

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    -2.5 A

  • Drain-source On Resistance-Max:

    0.18 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7.2 pF

  • JESD-30 Code:

    R-XBCC-N3

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD25484F4 Frequently Asked Questions (FAQs)

  • A good PCB layout for the CSD25484F4 should consider the following: keep the input and output traces short and away from each other, use a solid ground plane, and place decoupling capacitors close to the device. TI provides a recommended layout in the datasheet and application notes.
  • The CSD25484F4 requires a stable power supply with minimal noise and ripple. Use a high-quality voltage regulator, and decouple the device with a 10uF capacitor in parallel with a 100nF capacitor, placed close to the device. Additionally, use a 1uF capacitor on the output to filter out high-frequency noise.
  • The CSD25484F4 is specified to operate up to 100 MHz, but the actual frequency limit depends on the specific application and PCB layout. In general, it's recommended to operate the device at frequencies below 50 MHz to ensure optimal performance and minimize signal degradation.
  • The CSD25484F4 has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate at high temperatures or high currents. Monitor the device temperature and adjust the thermal design accordingly.
  • To ensure EMI and EMC compliance, follow proper PCB layout and grounding techniques, use shielding and filtering where necessary, and minimize signal radiation. TI provides guidelines for EMI and EMC compliance in the datasheet and application notes.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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