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CSD83325L - Texas Instruments

Description: CSD83325L 12-V Dual N-Channel NexFET™ Power MOSFET

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PCB Footprints
CSD83325L - Texas Instruments PCB footprint - Other - Other - YJE0006A
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CSD83325L - Texas Instruments  - 3D model - Other - YJE0006A
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CSD83325L Details

  • Manufacturer Part Number:

    CSD83325L

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    8 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    144 pF

  • JESD-30 Code:

    R-PBGA-B6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.3 W

  • Pulsed Drain Current-Max (IDM):

    52 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BUTT

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD83325L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-current paths short and wide, and use thermal vias to dissipate heat.
  • Monitor the device's junction temperature, voltage, and current. Ensure the device is operated within the recommended voltage and current ratings, and provide adequate heat sinking to prevent overheating.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. This value provides a good balance between filtering and stability.
  • Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke to reduce EMI. Also, ensure good PCB layout practices, such as separating high-frequency and low-frequency circuits.
  • The maximum allowed voltage on the bootstrap capacitor is 6.5V. Exceeding this voltage may damage the device.

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CSD83325L Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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