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DAC38RF82IAAV - Texas Instruments

Description: Dual-Channel, 14-Bit, 9-GSPS, 1x-24x Interpolating, 6 & 9 GHz PLL Digital-to-Analog Converter (DAC)

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DAC38RF82IAAV - Texas Instruments - PCB symbol
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DAC38RF82IAAV - Texas Instruments PCB footprint - BGA - BGA - AAV0144A
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DAC38RF82IAAV - Texas Instruments - 3D model - BGA - AAV0144A
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DAC38RF82IAAV Details

  • Manufacturer Part Number:

    DAC38RF82IAAV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A001.A.5.B.2.B

  • HTS Code:

    8542.39.00.40

  • Date Of Intro:

    2017-02-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.3 V

  • Analog Output Voltage-Min:

    1.3 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -1.8 V

  • Number of Bits:

    14

  • Number of Functions:

    1

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA144,12X12,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    9000 MHz

  • Seated Height-Max:

    1.94 mm

  • Settling Time-Nom (tstl):

    0.001 µs

  • Supply Current-Max:

    1250 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

DAC38RF82IAAV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane, separate analog and digital power planes, and a careful routing of sensitive signals is recommended. TI provides a reference design and layout guidelines in the DAC38RF82IAAV evaluation module documentation.
  • The DAC38RF82IAAV requires a high-quality clock source. Use a low-jitter clock source, and ensure the clock frequency is within the recommended range. For synchronization, use the SYNC_IN pin to synchronize multiple devices or use the internal clock generator. Refer to the datasheet and application notes for specific guidance.
  • Perform a full calibration cycle after power-up, and recalibrate after any changes to the device configuration. Use the CAL_START and CAL_DONE pins to control the calibration process. Refer to the datasheet and application notes for specific calibration procedures.
  • Ensure good airflow around the device, and use a heat sink or thermal pad if necessary. Monitor the device temperature using the THERM pin, and implement thermal throttling or shutdown if the temperature exceeds the recommended range.
  • Sequence the power supplies in the following order: AVDD, DVDD, and then the analog and digital input signals. Ensure the power supplies are within the recommended voltage ranges, and use a low-dropout regulator (LDO) or a switching regulator with a low noise output.

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DAC38RF82IAAV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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