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DAC39RF10ACK - Texas Instruments

Description: Digital to Analog Converters - DAC JESD 204B/C DUAL CH 10.24GSPS 16B IT DAC

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PCB Footprints
DAC39RF10ACK - Texas Instruments PCB footprint - BGA - BGA - ACK0256A
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3D Models
DAC39RF10ACK - Texas Instruments  - 3D model - BGA - ACK0256A
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DAC39RF10ACK Details

  • Manufacturer Part Number:

    DAC39RF10ACK

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A001.A.5.B.2.B

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    2.39 V

  • Analog Output Voltage-Min:

    1.21 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-XBGA-B256

  • Length:

    17 mm

  • Linearity Error-Max (EL):

    0.01373291%

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -1.8 V

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA256,16X16,39

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    20480 MHz

  • Seated Height-Max:

    2.78 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

DAC39RF10ACK Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DAC39RF10ACK evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • To configure the DAC39RF10ACK for optimal dynamic range and SNR, set the full-scale output current (IOUT_FS) to the maximum value (20mA), and adjust the output impedance (RLOAD) to match the load impedance. Additionally, ensure that the clock frequency is set to the recommended value (1.5GHz) and the digital input data is properly formatted.
  • The DAC39RF10ACK has an operating temperature range of -40°C to 85°C. Temperature affects the DAC's performance, particularly the gain error and offset voltage, which can increase with temperature. Ensure that the device is operated within the recommended temperature range to maintain optimal performance.
  • To synchronize multiple DAC39RF10ACK devices, use the SYNC_IN pin to synchronize the clock domains of each device. Ensure that the clock signals are properly aligned and that the devices are configured to use the same clock frequency and phase.
  • Texas Instruments recommends a power supply decoupling scheme that includes a combination of ceramic capacitors (100nF and 10uF) and a ferrite bead in series with the power supply lines to filter out noise and ensure stable operation.

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DAC39RF10ACK Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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