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DAC6311IDCKR - Texas Instruments

Description: 10bit, Single Channel, 80uA, 2.0V-5.5V DAC in SC70 Package

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PCB Footprints
DAC6311IDCKR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
DAC6311IDCKR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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DAC6311IDCKR Details

  • Manufacturer Part Number:

    DAC6311IDCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Linearity Error-Max (EL):

    0.0488%

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    10

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.083 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    10 µs

  • Settling Time-Nom (tstl):

    6 µs

  • Supply Current-Max:

    0.16 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

DAC6311IDCKR Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital inputs. This ensures proper device operation and prevents potential latch-up conditions.
  • To ensure accurate voltage output, it's essential to use a stable and low-noise voltage reference (VREF) and to decouple the VREF pin with a capacitor to reduce noise. Additionally, ensure that the output load is within the specified range to prevent output voltage droop.
  • The maximum output current of the DAC6311 is 5 mA. Exceeding this current may cause the output voltage to droop or the device to overheat.
  • To enter power-down mode, set the PD pin high. In this mode, the DAC's output is high-impedance, and the device consumes minimal power. When exiting power-down mode, ensure that the PD pin is set low before updating the DAC's output.
  • To minimize noise and ensure accurate operation, it's recommended to keep the analog and digital signal paths separate, use a solid ground plane, and keep the VREF and output traces short and shielded.

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DAC6311IDCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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