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DAC7563TDGSR - Texas Instruments

Description: DAC7563T Dual,12-Bit,Low Power with 2.5-V,4ppm/C Internal Ref,Reset to Mid-scale and 5V TTL I/O

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DAC7563TDGSR - Texas Instruments - PCB symbol
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PCB Footprints
DAC7563TDGSR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS (S-PDSO-G10)
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3D Models
DAC7563TDGSR - Texas Instruments - 3D model - Small Outline Packages - DGS (S-PDSO-G10)
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DAC7563TDGSR Details

  • Manufacturer Part Number:

    DAC7563TDGSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    5.5 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.1 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    7 µs

  • Settling Time-Nom (tstl):

    7 µs

  • Supply Voltage-Nom:

    5.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DAC7563TDGSR Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital interface signals. This ensures proper device operation and prevents potential latch-up conditions.
  • The output voltage settling time can be minimized by using a capacitor (e.g., 10nF) between the output pin and GND. This helps to filter out high-frequency noise and ensures a stable output voltage.
  • The maximum output current of the DAC7563 is 5mA. Exceeding this current limit may cause the device to overheat or malfunction.
  • To ensure accurate voltage output, the external reference voltage should be stable and noise-free. Additionally, the reference voltage should be within the specified range (1.2V to 5.5V) and should not exceed the maximum rating of the device.
  • The CLR (Clear) pin is used to reset the DAC7563 to its power-on state. When the CLR pin is pulled low, the device resets, and the output voltage returns to its default state (typically 0V). This pin can be used to initialize the device or to reset it in case of an error.

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DAC7563TDGSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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