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DAC7742YB/250 - Texas Instruments

Description: 16-Bit, Single Channel, Parallel Interface with Internal Reference

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DAC7742YB/250 - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PT (S-PQFP-G48
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DAC7742YB/250 - Texas Instruments  - 3D model - Quad Flat Packages - PT (S-PQFP-G48
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DAC7742YB/250 Details

  • Manufacturer Part Number:

    DAC7742YB/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Package Description:

    LQFP-48

  • Pin Count:

    48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    10 V

  • Analog Output Voltage-Min:

    -10 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    COMPLEMENTARY BINARY, COMPLEMENTARY OFFSET BINARY

  • Input Format:

    PARALLEL, WORD

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Linearity Error-Max (EL):

    0.0061%

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -15 V

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.2 MHz

  • Seated Height-Max:

    1.6 mm

  • Settling Time-Max:

    5 µs

  • Settling Time-Nom (tstl):

    5 µs

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

DAC7742YB/250 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital interface signals. This ensures proper device operation and prevents potential latch-up conditions.
  • The output voltage range of the DAC7742YB/250 is dependent on the VREF input voltage. The output voltage range is 0 to VREF, so ensure that VREF is set to the desired maximum output voltage. Additionally, consider using an output buffer amplifier if the output current or voltage swing requirements exceed the DAC's capabilities.
  • The DAC7742YB/250's performance is affected by temperature, with changes in offset error, gain error, and linearity. Ensure that the device is operated within the specified temperature range (-40°C to 125°C) and consider using temperature compensation techniques if high accuracy is required over a wide temperature range.
  • To minimize noise and interference, use proper PCB layout techniques, such as separating analog and digital signals, using ground planes, and decoupling power supplies. Additionally, consider using shielding, filtering, and bypass capacitors to reduce electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • The recommended layout and routing for the digital interface involves using short, matched traces, and avoiding vias and right-angle turns. Ensure that the digital interface signals are routed away from noisy signals and that the clock signal is routed closest to the device. Additionally, consider using a ground plane under the digital interface signals to reduce noise and crosstalk.

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DAC7742YB/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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