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DAC7811IDGSRG4 - Texas Instruments

Description: Digital to Analog Converters - DAC 12-Bit Serial Input Multiplying DAC

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DAC7811IDGSRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGS0010A 2021
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DAC7811IDGSRG4 - Texas Instruments  - 3D model - Small Outline Packages - DGS0010A 2021
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DAC7811IDGSRG4 Details

  • Manufacturer Part Number:

    DAC7811IDGSRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Output Voltage-Max:

    10 V

  • Analog Output Voltage-Min:

    -10 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    5 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    0.2 µs

  • Settling Time-Nom (tstl):

    0.2 µs

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DAC7811IDGSRG4 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCC first, followed by VREF, and then the digital inputs. This ensures proper device operation and prevents potential latch-up conditions.
  • The DAC7811 has an output voltage range of 0 to VREF. To ensure accurate output voltages, it's recommended to use an external voltage reference (VREF) that is within the specified range of 2.5V to 5.5V. Additionally, the output voltage should be buffered with an op-amp if it needs to drive a load.
  • The settling time of the DAC7811 is typically around 10μs. This means that the output voltage may take up to 10μs to stabilize after a code change. In high-speed applications, this settling time should be taken into account to ensure accurate output voltages. You may need to add a delay or use a synchronization mechanism to ensure that the output voltage has settled before taking a measurement or using it in your application.
  • The digital input signals to the DAC7811 should be driven with a low-impedance source, such as a CMOS logic gate or a dedicated digital output driver. The input signals should also be properly terminated to prevent ringing and ensure reliable data transfer. Additionally, the input signals should be synchronized with the clock signal to ensure proper data transfer and to prevent metastability issues.
  • The DAC7811 has a maximum junction temperature (TJ) of 150°C. In high-power or high-temperature applications, the device may require heat sinking or thermal management to prevent overheating. You should ensure that the device is operated within the specified temperature range and that adequate thermal design considerations are made to prevent thermal-related issues.

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DAC7811IDGSRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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