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DAC8811IBDGKR - Texas Instruments

Description: Digital to Analog Converters - DAC 16-Bit Serial Input Multiplying Cnvtr

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DAC8811IBDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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DAC8811IBDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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DAC8811IBDGKR Details

  • Manufacturer Part Number:

    DAC8811IBDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0031%

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    2 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    0.5 µs

  • Settling Time-Nom (tstl):

    0.5 µs

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DAC8811IBDGKR Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital inputs. This ensures that the internal circuitry is properly biased before the digital inputs are applied.
  • To ensure accurate voltage output, it is essential to decouple the VREF pin with a capacitor (e.g., 10nF) to reduce noise and ensure a stable reference voltage. Additionally, use a low-noise power supply and minimize noise on the digital inputs.
  • The maximum output current of the DAC8811 is 5mA. Exceeding this current may cause the output voltage to droop or the device to overheat.
  • During power-down or reset, the DAC8811's output is high-impedance, which means it is in a high-impedance state. To prevent unwanted voltage levels, it is recommended to add a pull-down resistor (e.g., 1kΩ) to the output pin to ensure a defined voltage level.
  • To minimize noise and ensure accurate performance, it is recommended to keep the analog and digital signal paths separate, use a solid ground plane, and keep the power supply and reference voltage traces short and wide.

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DAC8811IBDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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