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DAC8811ICDGKT - Texas Instruments

Description: 16-bit, single-channel, serial input multiplying DAC with 0.5us settling time

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DAC8811ICDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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DAC8811ICDGKT - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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DAC8811ICDGKT Details

  • Manufacturer Part Number:

    DAC8811ICDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.40

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Linearity Error-Max (EL):

    0.0015%

  • Moisture Sensitivity Level:

    2

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    2 MHz

  • Seated Height-Max:

    1.1 mm

  • Settling Time-Max:

    0.5 µs

  • Settling Time-Nom (tstl):

    0.5 µs

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DAC8811ICDGKT Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VREF, and then the digital inputs. This ensures that the internal circuitry is properly biased before the digital inputs are applied.
  • To ensure accurate voltage output, it is essential to use a low-noise, low-impedance voltage reference (VREF) and to decouple the VREF pin with a capacitor. Additionally, the output voltage should be buffered with an op-amp if it needs to drive a load.
  • The maximum output current of the DAC8811 is 5 mA. Exceeding this current limit may cause the output voltage to droop or the device to overheat.
  • During power-up and power-down, the digital inputs should be held in a static state (either high or low) to prevent unwanted output voltage transitions. It is recommended to use a pull-up or pull-down resistor to ensure a defined state.
  • The DAC8811's performance is affected by temperature, with the output voltage and linearity varying with temperature. The device is specified to operate over a temperature range of -40°C to 125°C, and the user should consider this when designing their system.

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DAC8811ICDGKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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