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DAN202UMFHTL - ROHM Semiconductor

Description: ROHM - DAN202UMFHTL - Small Signal Diode, Dual Common Cathode, 80 V, 100 mA, 1.2 V, 4 ns, 4 A

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DAN202UMFHTL - ROHM Semiconductor PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - DAN202UMFHTL
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3D Models
DAN202UMFHTL - ROHM Semiconductor  - 3D model - SO Transistor Flat Lead - DAN202UMFHTL
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DAN202UMFHTL Details

  • Manufacturer Part Number:

    DAN202UMFHTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-85, SOT-323FL, 3 PIN

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.4

  • Application:

    GENERAL PURPOSE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-F3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DAN202UMFHTL Frequently Asked Questions (FAQs)

  • A good PCB layout for the DAN202UMFHTL should include a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for the DAN202UMFHTL. Additionally, ensure good thermal management, and consider using a heat sink or thermal interface material if necessary.
  • Handle the DAN202UMFHTL by the body, avoiding touching the leads or die. Store the devices in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow ESD precautions during handling.
  • While the DAN202UMFHTL is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments. If operation in humid environments is necessary, consider using a conformal coating or potting the device to protect it from moisture.
  • The recommended soldering conditions for the DAN202UMFHTL are: peak temperature 260°C, soldering time 10 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point above 217°C.

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DAN202UMFHTL Overview

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