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DCPA10505P-U/700 - Texas Instruments

Description: Miniature, 1W Isolated Unregulated DC/DC Converters

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DCPA10505P-U/700 - Texas Instruments PCB footprint - Other - Other - DCPA10505P-U/700-1
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DCPA10505P-U/700 Details

  • Manufacturer Part Number:

    DCPA10505P-U/700

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.40.95.80

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    DC-DC UNREGULATED POWER SUPPLY MODULE

  • Approvals:

    UL

  • Control Mode:

    VOLTAGE-MODE

  • Efficiency (Main Output):

    85%

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDMA-G7

  • JESD-609 Code:

    e4

  • Length:

    19.18 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.2 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    4.5 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Protections:

    THERMAL

  • Ripple Voltage (Main Out):

    0.007 Vrms

  • Seated Height-Max:

    5.33 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Total Power Output-Max:

    1 W

  • Trim/Adjustable Output:

    NO

  • Width:

    6.605 mm

DCPA10505P-U/700 Frequently Asked Questions (FAQs)

  • TI recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow TI's recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet. However, TI recommends following the absolute maximum ratings and ensuring the device operates within the recommended operating conditions to prevent damage.
  • While the DCPA10505P-U/700 is a high-performance device, it is not specifically designed or qualified for high-reliability or aerospace applications. TI offers other products that are specifically designed and qualified for these applications.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly configured and that the output voltage is within the recommended range. Consult TI's application notes and technical support resources for further assistance.

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DCPA10505P-U/700 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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