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DDC232CZXGR - Texas Instruments

Description: Analog to Digital Converters - ADC 20B,32Ch currrent inputs

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DDC232CZXGR - Texas Instruments - PCB symbol
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PCB Footprints
DDC232CZXGR - Texas Instruments PCB footprint - BGA - BGA - ZXG (S-PBGA-N64)
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3D Models
DDC232CZXGR - Texas Instruments - 3D model - BGA - ZXG (S-PBGA-N64)
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DDC232CZXGR Details

  • Manufacturer Part Number:

    DDC232CZXGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    LFBGA-64

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    5.25 V

  • Conversion Time-Max:

    135.6 µs

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    S-PBGA-B64

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Linearity Error-Max (EL):

    0.05%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    32

  • Number of Bits:

    20

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY, OFFSET BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA64,8X8,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.003125 MHz

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

DDC232CZXGR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DDC232CZXGR evaluation module documentation, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The DDC232CZXGR has a programmable gain amplifier and input range settings that can be configured through the SPI interface. Refer to the datasheet and application notes for specific register settings and configuration examples.
  • The DDC232CZXGR's SPI interface can operate at a maximum clock frequency of 50 MHz, allowing for a data transfer rate of up to 50 Mbps.
  • The DDC232CZXGR has built-in overvoltage and undervoltage protection on the input channels, which can withstand voltages up to ±20 V without damage. However, it is still recommended to use external protection circuitry to prevent damage from excessive voltage transients.
  • The DDC232CZXGR is specified to operate from -40°C to 125°C, but the device's performance and accuracy may degrade at higher temperatures. Refer to the datasheet for specific temperature-related specifications and limitations.

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DDC232CZXGR Overview

Use the download button to access the DDC232CZXGR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DDC23, or try a keyword search, such as Analog to Digital Converters

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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