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DDC316CZXGR - Texas Instruments

Description: 16-Channel Current-Input 16-Bit Analog-to-Digital Converter (ADC)

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DDC316CZXGR - Texas Instruments PCB footprint - BGA - BGA - ZXG (S-PBGA-N64)
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DDC316CZXGR - Texas Instruments  - 3D model - BGA - ZXG (S-PBGA-N64)
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DDC316CZXGR Details

  • Manufacturer Part Number:

    DDC316CZXGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA-64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-02-12

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog Input Voltage-Max:

    14.4 V

  • Analog Input Voltage-Min:

    9.6 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PBGA-B64

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    16

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    BINARY, OFFSET BINARY

  • Output Format:

    SERIAL, PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA64,8X8,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    0.1 MHz

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

DDC316CZXGR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using decoupling capacitors to reduce noise and ensure signal integrity.
  • To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unused features, and use the power-down mode when not in use. Additionally, consider using a low-dropout regulator (LDO) to reduce power consumption.
  • The DDC316CZXGR is rated for operation from -40°C to 125°C, but it's essential to consider the specific application and ensure that the device is properly heat-sinked and cooled to prevent overheating.
  • Implement error-checking mechanisms, such as CRC or checksum, to detect data corruption during transmission. Additionally, use a reliable communication protocol, such as SPI or I2C, and ensure that the clock frequency is within the recommended range.
  • Texas Instruments recommends using 0.1 μF to 1 μF decoupling capacitors, depending on the specific application and operating frequency. It's essential to place these capacitors close to the device's power pins to reduce noise and ensure signal integrity.

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DDC316CZXGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image DDC316CGXGR Texas Instruments

ADC, Proprietary Method, 16-Bit, 1 Func, 16 Channel, Serial, Parallel, Word Access, PBGA64