Infineon provides a recommended PCB layout in the application note AN2019-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
Infineon recommends using a gate driver with a high current capability (e.g., 2A or higher) and a low propagation delay (e.g., < 50ns) to ensure proper switching of the DF1000R17IE4. The 1EDN TxD and 1EDN8550B gate drivers are suitable options.
According to Infineon's application note AN2019-03, the maximum allowed voltage overshoot during turn-on and turn-off is 1.5 times the maximum rated voltage (VDS) of the device, which is 1700V for the DF1000R17IE4.
Infineon recommends following the guidelines in the application note AN2019-03 for EMC design considerations, including using a shielded gate driver, minimizing loop areas, and using a common mode choke to reduce electromagnetic interference.
Infineon recommends using a forced air cooling system or a liquid cooling system with a heat sink specifically designed for the DF1000R17IE4. The application note AN2019-03 provides more detailed guidelines for thermal management.
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DF1000R17IE4 Overview
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