HALOGEN FREE AND ROHS COMPLIANT, MINI5-G3-B, MO-178, SC-74A, 5 PIN
ECCN Code:
EAR99
Manufacturer:
Panasonic Electronic Components
Collector Current-Max (IC):
0.1 A
Collector-Emitter Voltage-Max:
50 V
Configuration:
COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE):
160
JEDEC-95 Code:
MO-178AA
JESD-30 Code:
R-PDSO-G5
JESD-609 Code:
e6
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
5
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Polarity/Channel Type:
NPN
Surface Mount:
YES
Terminal Finish:
TIN BISMUTH
Terminal Form:
GULL WING
Terminal Position:
DUAL
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
DMC261050R Frequently Asked Questions (FAQs)
The recommended land pattern for the DMC261050R can be found in the Panasonic Electronic Components' recommended land pattern document or by consulting with a PCB design expert. A general guideline is to use a land pattern with a minimum pad size of 1.5mm x 1.5mm and a spacing of 0.5mm between pads.
To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB underneath the DMC261050R, and to use a thermal interface material (TIM) between the device and the heat sink. The thermal pad should be connected to a ground plane or a dedicated thermal management layer.
The maximum operating temperature range for the DMC261050R is -40°C to +125°C, as specified in the datasheet. However, it's recommended to derate the device's power dissipation according to the temperature to ensure reliable operation.
The DMC261050R is designed to withstand moderate vibration levels, but it's recommended to consult with Panasonic Electronic Components or a reliability expert to determine the suitability of the device for high-vibration environments. Additional mechanical support or fixation may be required.
To ensure reliability in humid environments, it's recommended to follow proper PCB design and assembly guidelines, including the use of moisture-resistant materials and conformal coating. Additionally, consider using a humidity sensor and implementing humidity-related fault detection and protection mechanisms.
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DMC261050R Overview
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