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DMG264120R - Panasonic

Description: DMG264120R, Dual Digital Transistor, NPN, PNP 500 (NPN) mA, -500 (PNP) mA 50 (NPN) V, -50 (PNP) V 4.7 kΩ, Ratio Of 1

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Symbol
DMG264120R - Panasonic - PCB symbol
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PCB Footprints
DMG264120R - Panasonic PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - mini6-g4-b-ren1
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3D Models
DMG264120R - Panasonic - 3D model - SOT23 (6-Pin) - mini6-g4-b-ren1
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DMG264120R Details

  • Manufacturer Part Number:

    DMG264120R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MINI6-G4-B, SC-74, 6 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Panasonic Electronic Components

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO 1

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PDSO-G6

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN AND PNP

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMG264120R Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package is recommended for heat dissipation. A copper pour on the PCB with multiple vias to a solid ground plane is also recommended to reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C to prevent damage to the device.
  • Handle the device with ESD-protective equipment and follow proper ESD-handling procedures. Use an ESD-protective bag or wrapping material for storage and transportation.
  • Use a gold wire bonding process with a ball bond diameter of 1.5-2.5 mils. For die attach, use a silver-filled epoxy adhesive with a bond line thickness of 1-2 mils.

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DMG264120R Overview

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