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- Stock & Prices $ Price & Stock for DMN53D0LQ-13
- Part Number DMN53D0LQ-13
- Manufacturer Diodes Incorporated
- Pin Count 3
- Part Category MOSFET (N-Channel)
- Package Category SOT23 (3-Pin)
- Footprint Name SOT23 (3-Pin) - DMN53D0LQ-13
- Released Date Sep 15, 2021
- Last Modified Date Jun 25, 2024 8:07 AM UTC
- Pinout / Pin List Click Here (Member Only)
DMN53D0LQ-13 Details
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Manufacturer Part Number:
DMN53D0LQ-13
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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Factory Lead Time:
12 Weeks
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Manufacturer:
Diodes Incorporated
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YTEOL:
7
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Additional Feature:
HIGH RELIABILITY
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
50 V
DMN53D0LQ-13 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the DMN53D0LQ-13 is a QFN3030-13 package with a 3x3mm body size and 0.5mm pitch. A recommended land pattern can be found in the Diodes Incorporated's QFN3030-13 package outline drawing.
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The DMN53D0LQ-13 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to improve heat dissipation. A thermal via array or a copper pour on the PCB can also help to dissipate heat. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
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The DMN53D0LQ-13 has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
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The DMN53D0LQ-13 is an AEC-Q101 qualified device, making it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, PCB design, and manufacturing guidelines to ensure the device meets the required reliability and quality standards.
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The DMN53D0LQ-13 has a QFN package with a solderable thermal pad on the bottom. Ensure the PCB is designed with a thermal land pattern, and use a soldering process with a peak temperature of 260°C or less. A soldering profile with a slow ramp-up and cool-down rate can help prevent thermal shock and ensure reliable solder joints.
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DMN53D0LQ-13 Overview
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