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DMNH10H021SPSW-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 61V 100V PowerDI5060-8 T&R 2.5K

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DMNH10H021SPSW-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI5060- 8 (SWP) (Type UX)
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DMNH10H021SPSW-13 - Diodes Incorporated  - 3D model - Other - PowerDI5060- 8 (SWP) (Type UX)
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DMNH10H021SPSW-13 Details

  • Manufacturer Part Number:

    DMNH10H021SPSW-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    157 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    58 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    91 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    4.4 W

  • Pulsed Drain Current-Max (IDM):

    232 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMNH10H021SPSW-13 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the device, connecting it to a large copper area on the PCB, and ensuring good thermal conductivity between the device and the PCB.
  • To ensure proper soldering, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid applying excessive force or pressure during the soldering process.
  • The maximum operating temperature range for the DMNH10H021SPSW-13 is -55°C to 150°C, as specified in the datasheet.
  • Yes, the DMNH10H021SPSW-13 is suitable for high-reliability and automotive applications, as it meets the requirements for AEC-Q101 qualification and is designed for high-reliability and ruggedness.
  • To handle ESD protection, follow proper handling and storage procedures, use ESD-protective packaging and materials, and ensure that the device is properly grounded during assembly and testing.

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DMNH10H021SPSW-13 Overview

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