DMP6185SK3-13 footprint, schematic symbol and 3D model by Diodes Incorporated

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PCB Footprints

DMP6185SK3-13 - Diodes Incorporated PCB footprint - Other - Other - DMP6185SK3-13-3

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Datasheet Download Datasheet
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Part Number DMP6185SK3-13
Manufacturer Diodes Incorporated
Pin Count 3
Part Category MOSFET (P-Channel)
Package Category Other
Footprint Name Other - DMP6185SK3-13-3
Released Date Feb 3, 2021
Last Modified Date Jun 25, 2024 8:06 AM UTC
Pinout / Pin List Click Here (Member Only)

DMP6185SK3-13 Details

Manufacturer Part Number:
DMP6185SK3-13
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
DPAK-3/2
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
12 Weeks
Manufacturer:
Diodes Incorporated
YTEOL:
7
Additional Feature:
HIGH RELIABILITY
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
60 V
Drain Current-Max (ID):
3.6 A
Drain-source On Resistance-Max:
0.15 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
32 pF
JEDEC-95 Code:
TO-252
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
P-CHANNEL
Power Dissipation-Max (Abs):
2.8 W
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

DMP6185SK3-13 Frequently Asked Questions (FAQs)

A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to achieve this.
Handle the device in an ESD-controlled environment, wear an ESD strap, and use ESD-safe tools and materials to prevent damage. Avoid touching the device pins or exposing it to static electricity.
The device is rated for operation up to 125°C. However, the maximum junction temperature should not exceed 150°C. Ensure proper thermal management and derate the device accordingly for high-temperature applications.
Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply, input voltage, and biasing circuit for any anomalies. Consult the datasheet and application notes for troubleshooting guidelines.

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DMP6185SK3-13 Overview

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