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DP83825IRMQR - Texas Instruments

Description: DP83825I LowPower 10/100 Mbps Ethernet Physical Layer Transceiver

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DP83825IRMQR - Texas Instruments - PCB symbol
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PCB Footprints
DP83825IRMQR - Texas Instruments PCB footprint - Other - Other - DP83825IRMQR-5
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3D Models
DP83825IRMQR - Texas Instruments - 3D model - Other - DP83825IRMQR-5
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DP83825IRMQR Details

  • Manufacturer Part Number:

    DP83825IRMQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-09-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    100000 Mbps

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

DP83825IRMQR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DP83825IRMQR evaluation module documentation, which includes guidelines for component placement, routing, and thermal management.
  • The DP83825IRMQR can be configured using the SPI interface or through the use of external resistors to set the desired configuration. Refer to the datasheet and application notes for specific configuration options and guidelines.
  • The DP83825IRMQR requires a specific power sequencing order to ensure proper operation. The recommended power-up sequence is VCC, then VCCA, and finally VCCIO. Refer to the datasheet for specific power sequencing guidelines.
  • Texas Instruments provides a troubleshooting guide for the DP83825IRMQR, which includes steps for identifying and resolving common issues such as link faults, packet loss, and PHY register access errors.
  • The DP83825IRMQR has a maximum junction temperature of 125°C. To ensure reliable operation, it is recommended to implement thermal management techniques such as heat sinking, thermal vias, and airflow management to keep the device within its operating temperature range.

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DP83825IRMQR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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