Part Image

DP83910AV/63SN - Texas Instruments

Description: Ethernet ICs CMOS serial network interface (SNI) 28-PLCC

Download DP83910AV/63SN Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
DP83910AV/63SN - Texas Instruments PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - NS Package Number V28A
click to zoom
3D Models
DP83910AV/63SN - Texas Instruments  - 3D model - Plastic Leaded Chip Carrier - NS Package Number V28A
click to zoom

DP83910AV/63SN Details

  • Manufacturer Part Number:

    DP83910AV/63SN

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLCC-28

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Data Rate:

    10000000000 Mbps

  • JESD-30 Code:

    S-PQCC-J28

  • JESD-609 Code:

    e3

  • Length:

    11.43 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Transceivers:

    4

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    4.57 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11.43 mm

DP83910AV/63SN Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good design practices, such as keeping the analog and digital grounds separate, using a solid ground plane, and minimizing signal trace lengths. Additionally, ensure that the crystal oscillator is placed close to the device and that the layout is symmetrical to reduce EMI.
  • To ensure reliable operation in high-temperature environments, it's crucial to follow proper thermal design practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Additionally, consider using a thermal interface material between the device and the heat sink, and ensure that the device is operated within its specified temperature range.
  • Potential sources of EMI in a system using the DP83910AV/63SN include the crystal oscillator, signal traces, and power supply lines. To mitigate EMI, use shielding, keep signal traces short and away from the edge of the PCB, use a common-mode choke on the power supply lines, and ensure that the device is properly grounded. Additionally, consider using EMI filters or ferrite beads on the signal lines.
  • To troubleshoot issues with the DP83910AV/63SN, start by verifying that the device is properly configured and that the clock signal is stable. Check the signal integrity on the transmit and receive lines, and ensure that the device is properly powered. Use a logic analyzer or oscilloscope to capture and analyze the signal waveforms, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • When using the DP83910AV/63SN in a system with multiple devices, it's essential to ensure that each device has a unique MAC address and that the devices are properly configured to communicate with each other. Use a suitable communication protocol, such as TCP/IP or UDP, and ensure that the devices are properly synchronized. Consider using a network switch or router to manage the communication between devices, and ensure that the system is designed to handle the required data throughput.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

DP83910AV/63SN Overview

Use the download button to access the DP83910AV/63SN schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DP839, or try a keyword search, such as Network Interfaces

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to DP83910AV/63SN

Showing 0 results