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DP83TC813RRHFRQ1 - Texas Instruments

Description: Ethernet ICs Automotive Low-Power, Small Footprint 100BASE-T1 Ethernet PHY

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DP83TC813RRHFRQ1 - Texas Instruments - PCB symbol
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PCB Footprints
DP83TC813RRHFRQ1 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RHF0028B
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3D Models
DP83TC813RRHFRQ1 - Texas Instruments - 3D model - Quad Flat No-Lead - RHF0028B
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DP83TC813RRHFRQ1 Details

  • Manufacturer Part Number:

    DP83TC813RRHFRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Data Rate:

    100000 Mbps

  • JESD-30 Code:

    R-PQCC-N28

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

DP83TC813RRHFRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DP83TC813RRHFRQ1 evaluation module (EVM) user's guide, which can be found on the TI website. The EVM user's guide includes a detailed layout guide, including Gerber files and PCB design files.
  • The DP83TC813RRHFRQ1 is a highly configurable device, and configuration is typically done through the use of registers. Texas Instruments provides a register programming guide in the device datasheet, as well as a software development kit (SDK) that includes example code and a graphical user interface (GUI) for configuring the device.
  • The DP83TC813RRHFRQ1 has a thermal pad on the bottom of the package that must be connected to a thermal ground plane on the PCB to ensure proper heat dissipation. Texas Instruments recommends using a thermal interface material (TIM) between the thermal pad and the thermal ground plane, and provides thermal resistance values in the datasheet to aid in thermal design.
  • Texas Instruments provides a troubleshooting guide in the device datasheet, which includes common issues and their solutions. Additionally, the TI website has a knowledge base and community forums where engineers can ask questions and get help from TI experts and other users.
  • The recommended power-up sequence for the DP83TC813RRHFRQ1 is to power up the 1.8V supply (VDD) first, followed by the 3.3V supply (VDDA). This ensures that the internal voltage regulators are powered up in the correct order. Texas Instruments provides a detailed power-up sequence in the device datasheet.

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DP83TC813RRHFRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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