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DS14C335MSAX/NOPB - Texas Instruments

Description: RS-232 Interface IC SUPPLY TIA/EIA-232 3X5 DRVR/RECEIVER R 595-SN75LV4737ADBR

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DS14C335MSAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G28)
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DS14C335MSAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DB (R-PDSO-G28)
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DS14C335MSAX/NOPB Details

  • Manufacturer Part Number:

    DS14C335MSAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    GREEN, EIAJ TYPE2, SSOP-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    1 RECEIVER ACTIVE UNDER SHUTDOWN; EXTERNAL CHARGE PUMP

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-E; TIA-232-E; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.002 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1000 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1000 ns

  • Width:

    5.3 mm

DS14C335MSAX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS14C335MSAX/NOPB involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its specified temperature range, use a heat sink if necessary, and follow proper thermal design and layout guidelines. Additionally, consider using thermal protection devices or thermal sensors to monitor temperature.
  • When using the DS14C335MSAX/NOPB in a system with multiple voltage domains, ensure that the device is powered from a single voltage domain, and use level translators or voltage regulators to interface with other voltage domains. Also, consider the impact of voltage domain switching on the device's operation.
  • To troubleshoot issues with the DS14C335MSAX/NOPB, start by reviewing the datasheet and application notes, checking the device's configuration and programming, and verifying the PCB layout and signal integrity. Use oscilloscopes, logic analyzers, or other diagnostic tools to identify the root cause of the issue.
  • When using the DS14C335MSAX/NOPB in a system with EMI or RFI, ensure that the device is properly shielded, use EMI filters or chokes, and follow proper PCB layout and grounding techniques to minimize radiation and susceptibility. Consider using EMI-compliant components and following EMI/RFI design guidelines.

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DS14C335MSAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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