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DS1813R-10+T&R - Analog Devices

Description: Maxim DS1813R-10+T&R, Voltage Supervisor 4.25 → 4.49 V, Reset Input, 3-Pin SOT-23

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DS1813R-10+T&R - Analog Devices PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 21-0051_1
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DS1813R-10+T&R - Analog Devices  - 3D model - SOT23 (3-Pin) - 21-0051_1
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DS1813R-10+T&R Details

  • Manufacturer Part Number:

    DS1813R-10+T&R

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    3-SOT_23-N/A

  • Package Description:

    TSSOP, TO-236

  • Pin Count:

    3

  • Manufacturer Package Code:

    3-SOT_23-N/A

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1999-11-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    VOLTAGE SUPERVISOR/RESET IC

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Supply Current-Max (Isup):

    0.04 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +4.35V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.3 mm

DS1813R-10+T&R Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS1813R-10+T&R involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The DS1813R-10+T&R requires a stable power supply with a minimum of 3.3V and a maximum of 5.5V. Decoupling capacitors of 0.1uF and 10uF should be placed close to the device, with the 0.1uF capacitor connected between the VCC and GND pins, and the 10uF capacitor connected between the VCC pin and a solid ground plane.
  • The maximum clock frequency for the DS1813R-10+T&R is 10MHz. However, the device can operate at higher frequencies with reduced performance and increased power consumption.
  • The DS1813R-10+T&R can be programmed using a 3-wire serial interface. The device requires a specific sequence of commands and data to configure its registers and set its operating mode. Refer to the datasheet and application notes for detailed programming information.
  • The typical power consumption of the DS1813R-10+T&R is around 1.5mA at 3.3V and 10MHz clock frequency. However, power consumption can vary depending on the operating mode, clock frequency, and output loading.

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DS1813R-10+T&R Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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