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DS25BR101TSD/NOPB - Texas Instruments

Description: 3.125 Gbps LVDS Buffer with Transmit Pre-Emphasis and Receive Equalization

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PCB Footprints
DS25BR101TSD/NOPB - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - NGQ0008A25
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DS25BR101TSD/NOPB - Texas Instruments  - 3D model - Small Outline No-lead - NGQ0008A25
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DS25BR101TSD/NOPB Details

  • Manufacturer Part Number:

    DS25BR101TSD/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WSON-8

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.00001 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    43 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    0.465 ns

  • Width:

    3 mm

DS25BR101TSD/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-speed PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines.
  • To ensure signal integrity, use a signal integrity analysis tool to simulate the signal transmission and identify potential issues. Also, follow best practices for high-speed design, such as using differential signaling, terminating transmission lines, and minimizing crosstalk.
  • The maximum cable length supported by the DS25BR101TSD/NOPB depends on the specific application and the type of cable used. As a general guideline, the device can support cable lengths up to 10 meters at 10 Gbps. However, it's recommended to consult the datasheet and perform signal integrity analysis to determine the maximum cable length for a specific application.
  • To troubleshoot issues with the DS25BR101TSD/NOPB, use a combination of tools such as oscilloscopes, signal generators, and logic analyzers to analyze the signal transmission. Also, consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • While the DS25BR101TSD/NOPB is primarily designed for PCIe applications, it can be used in other high-speed applications such as SATA or Ethernet. However, the device's performance and functionality may vary depending on the specific application, and additional design considerations may be required.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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