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DS26LS31CMX - Texas Instruments

Description: IC LINE DVR QUAD HI SPD 16-SOIC

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DS26LS31CMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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DS26LS31CMX - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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DS26LS31CMX Details

  • Manufacturer Part Number:

    DS26LS31CMX

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, MS-012AC, SOIC-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422; FED STD 1020

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transmit Delay-Max:

    15 ns

  • Width:

    3.9 mm

DS26LS31CMX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device.
  • To ensure reliable operation, it's crucial to follow the recommended operating conditions, including temperature, voltage, and current. Additionally, consider using thermal management techniques, such as heat sinks or thermal pads, to maintain a stable temperature.
  • Operating the device outside the recommended supply voltage range can affect its performance, power consumption, and reliability. Lower voltages may reduce power consumption but can also decrease the device's speed and increase its susceptibility to noise. Higher voltages can increase speed but may also increase power consumption and reduce the device's lifespan.
  • The DS26LS31CMX has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during manufacturing, assembly, and testing. Use ESD-safe materials, grounding straps, and follow recommended handling techniques to prevent damage.
  • When using the DS26LS31CMX in a high-reliability or safety-critical application, consider implementing redundant systems, error detection and correction mechanisms, and fault-tolerant design techniques. Additionally, ensure that the device is properly validated and qualified for the specific application.

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DS26LS31CMX Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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