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DS26LS31MJ-SMD - Texas Instruments

Description: Quad Transmitter RS-422 16-Pin CDIP Tube

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DS26LS31MJ-SMD - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - NFE0016A
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DS26LS31MJ-SMD - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - NFE0016A
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DS26LS31MJ-SMD Details

  • Manufacturer Part Number:

    DS26LS31MJ-SMD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    LG_MAX; SEATED HGT-NOM

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422; FED STD 1020

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.94 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.02 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    30 ns

  • Width:

    7.62 mm

DS26LS31MJ-SMD Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS26LS31MJ-SMD involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
  • To ensure proper power and decoupling, use a high-quality power supply, add decoupling capacitors (e.g., 0.1uF and 10uF) close to the device, and consider adding a ferrite bead or inductor in series with the power supply to filter out noise.
  • The DS26LS31MJ-SMD has a maximum data transfer rate of 100 Mbps, making it suitable for high-speed applications.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking airflow around the device. The device's thermal pad should be connected to a solid ground plane to help dissipate heat.
  • The DS26LS31MJ-SMD has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Latch-up prevention can be achieved by following proper power-up and power-down sequences, and using a power-on reset circuit if necessary.

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DS26LS31MJ-SMD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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