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DS26LS32CMX - Texas Instruments

Description: IC LINE RCVR QUAD DIFF 16-SOIC

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DS26LS32CMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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DS26LS32CMX - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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DS26LS32CMX Details

  • Manufacturer Part Number:

    DS26LS32CMX

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Driver Number of Bits:

    4

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422; EIA-423; FED STD 1020; FED STD 1030

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    25 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.753 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    TTL

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.9 mm

DS26LS32CMX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as separating analog and digital grounds, using a solid ground plane, and minimizing trace lengths. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure the DS26LS32CMX operates within the specified temperature range (-40°C to 125°C), it's crucial to provide adequate heat sinking, especially in high-power applications. Use a thermal pad or a heat sink with a thermal conductivity of at least 1 W/m-K, and ensure good airflow around the device.
  • The maximum allowed voltage on the input pins is 5.5V. To protect against overvoltage, use voltage-limiting resistors or a voltage clamp circuit to prevent voltage exceeding the maximum rating. Additionally, consider using a TVS (Transient Voltage Suppressor) diode to protect against voltage spikes and transients.
  • To ensure proper operation, follow the recommended power-up and power-down sequencing in the datasheet. Power up the device in the following order: VCC, VREF, and then the input signals. When powering down, reverse the sequence. Additionally, consider using a power sequencing controller or a voltage supervisor to ensure proper power-up and power-down sequencing.
  • The recommended input impedance for the DS26LS32CMX is 1 kΩ or higher. A lower input impedance can lead to signal attenuation, distortion, and increased power consumption. Ensure that the input impedance is within the recommended range to maintain signal integrity and optimal device performance.

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DS26LS32CMX Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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