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DS26LV32ATM/NOPB - Texas Instruments

Description: 3V Enhanced CMOS Quad Differential Line Receiver

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DS26LV32ATM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC_
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DS26LV32ATM/NOPB Details

  • Manufacturer Part Number:

    DS26LV32ATM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC , SOIC-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; V.11

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.006 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    35 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

DS26LV32ATM/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout practice is to use a multi-layer board with a solid ground plane, keep the signal traces short and away from the edge of the board, and use a termination resistor at the receiving end. Additionally, use a 50-ohm transmission line impedance and maintain a consistent signal return path.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within its recommended operating temperature range (-40°C to 85°C). Also, provide adequate heat sinking, use a thermally conductive material for the PCB, and consider using a heat spreader or thermal interface material.
  • The recommended power sequencing is to power up the VCC supply before the VTT supply. The VCC supply should be powered up to a minimum of 2.3V before the VTT supply is powered up. The VTT supply should be powered up to a minimum of 1.65V.
  • To troubleshoot signal integrity issues, use an oscilloscope to measure the signal waveform and check for signal reflections, ringing, or distortion. Verify that the signal traces are properly terminated, and the signal return path is consistent. Also, check the power supply noise and ensure that it is within the recommended specifications.
  • To minimize EMI and RFI, use a shielded enclosure, keep the signal traces short and away from the edge of the board, and use a common-mode choke or ferrite bead on the signal lines. Also, ensure that the power supply is well-regulated and filtered to minimize noise.

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DS26LV32ATM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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