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DS30BA101SQ/NOPB - Texas Instruments

Description: 3.125-Gbps differential buffer

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DS30BA101SQ/NOPB - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RUM0016A_
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3D Models
DS30BA101SQ/NOPB - Texas Instruments  - 3D model - Quad Flat No-Lead - RUM0016A_
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DS30BA101SQ/NOPB Details

  • Manufacturer Part Number:

    DS30BA101SQ/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WQFN-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    59 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.465 V

  • Supply Voltage1-Min:

    3.135 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

DS30BA101SQ/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS30BA101SQ involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The DS30BA101SQ requires a clean and stable power supply. Ensure that the power supply voltage is within the recommended range, and use a low-ESR capacitor (e.g., 0.1 μF) close to the device to decouple the power pins. Additionally, use a bulk capacitor (e.g., 10 μF) farther away from the device to filter out noise.
  • The DS30BA101SQ is capable of transmitting data at speeds up to 3.2 Gbps. However, the actual data rate achieved will depend on the quality of the signal, the length of the transmission line, and the receiver's capabilities.
  • To troubleshoot issues with the DS30BA101SQ, start by verifying that the power supply is within the recommended range and that the device is properly decoupled. Check the signal integrity using an oscilloscope, and ensure that the transmission line is properly terminated. If issues persist, consult the datasheet and application notes for guidance.
  • Yes, the DS30BA101SQ can be used in a multi-lane configuration to increase the overall data transfer rate. However, this requires careful planning and design to ensure that the lanes are properly synchronized and that the signals are properly routed.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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