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DS34C86TMX - Texas Instruments

Description: RS-485/RS-422 ICs 0/4 4.5V ~ 5.5V SOIC-16_150mil RoHS

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DS34C86TMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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DS34C86TMX - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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DS34C86TMX Details

  • Manufacturer Part Number:

    DS34C86TMX

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422; EIA-423; FED STD 1020; FED STD 1030

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Low Current-Max:

    0.006 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    30 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.9 mm

DS34C86TMX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and using impedance-controlled traces. Additionally, ensure that the device is placed near the edge of the board to reduce signal reflections.
  • The DS34C86TMX requires a specific power sequencing order to prevent damage. Ensure that the VCC supply is powered up before the VCCIO supply, and that both supplies are powered down in the reverse order. A power sequencing circuit or a dedicated power management IC can be used to ensure proper sequencing.
  • The maximum cable length supported by the DS34C86TMX depends on the specific application and the type of cable used. As a general guideline, the device can support cable lengths up to 10 meters at data rates up to 3.2 Gbps. However, it's recommended to consult the datasheet and perform signal integrity simulations to determine the maximum cable length for a specific application.
  • The DS34C86TMX supports multiple data rates, and the configuration depends on the specific application. Consult the datasheet for the recommended settings for each data rate, including the clock frequency, transmitter equalization, and receiver equalization. Additionally, use the device's built-in self-test features to verify the configuration.
  • The DS34C86TMX has a maximum junction temperature of 125°C. Ensure that the device is properly heatsinked, and the PCB design allows for adequate airflow. Use thermal simulation tools to estimate the device's temperature and design a suitable thermal management strategy.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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