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DS34LV86TMX - Texas Instruments

Description: Quad Receiver RS-422 16-Pin SOIC T/R

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DS34LV86TMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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DS34LV86TMX - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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DS34LV86TMX Details

  • Manufacturer Part Number:

    DS34LV86TMX

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; V.11

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Low Current-Max:

    0.006 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    35 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    15 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.9 mm

DS34LV86TMX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the input and output traces are well-separated to reduce crosstalk.
  • The DS34LV86TMX requires a specific power-up and power-down sequencing to ensure proper operation. The VCC pin should be powered up before the VEE pin, and the VEE pin should be powered down before the VCC pin. This sequencing helps prevent latch-up and ensures reliable operation.
  • The maximum cable length supported by the DS34LV86TMX depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 10 meters at a data rate of 1 Gbps. For longer cable lengths, repeaters or active cables may be necessary.
  • To troubleshoot signal integrity issues, use a high-speed oscilloscope to measure the signal quality at the input and output of the device. Check for signal attenuation, jitter, and ringing. Ensure that the PCB layout and termination are correct, and that the device is properly powered and configured.
  • Yes, the DS34LV86TMX can be used in non-PCIe applications, such as SATA, SAS, or custom high-speed interfaces. However, the device's configuration and pinout may need to be modified to accommodate the specific application requirements.

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DS34LV86TMX Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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