COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER
Differential Output:
YES
Driver Number of Bits:
1
High Level Input Current-Max:
0.00002 A
Input Characteristics:
DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type:
LINE TRANSCEIVER
Interface Standard:
V.11; EIA-422-A; TIA-422-A; EIA-485; TIA-485
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e0
Length:
4.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
70 °C
Out Swing-Min:
1.5 V
Output Low Current-Max:
0.016 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
235
Qualification Status:
Not Qualified
Receive Delay-Max:
70 ns
Receiver Number of Bits:
1
Seated Height-Max:
1.75 mm
Supply Current-Max:
60 mA
Supply Voltage-Max:
5.25 V
Supply Voltage-Min:
4.75 V
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
COMMERCIAL
Terminal Finish:
TIN LEAD
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
20
Transmit Delay-Max:
60 ns
Width:
3.9 mm
DS36276MX Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as separating analog and digital grounds, using a solid ground plane, and minimizing trace lengths and loops. Additionally, consider using a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
The internal oscillator can be configured using the OSCEN and OSCSEL pins. Ensure that the oscillator is enabled (OSCEN = 1) and select the desired clock source (OSCSEL = 0 for internal oscillator or OSCSEL = 1 for external clock). Also, make sure to follow the recommended crystal oscillator circuit configuration and component values.
The DS36276MX is rated for operation up to 125°C, but it's essential to consider the device's power consumption, thermal resistance, and package type when operating in high-temperature environments. Ensure proper heat sinking, and consider using a thermally enhanced package (e.g., QFN) for better heat dissipation.
The DS36276MX has an internal POR and BOR circuitry. Ensure that the power supply is stable and within the recommended voltage range during startup. Use a suitable external capacitor value for the POR pin, and consider adding an external BOR circuit with a voltage detector and a reset generator IC for added reliability.
Follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths and loops, and using shielding and filtering components. Ensure that the device is properly decoupled, and consider using a common-mode choke or ferrite beads to reduce EMI. Also, follow the recommended layout and component placement guidelines for the device's pins.
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DS36276MX Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
