COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER
Differential Output:
YES
Driver Number of Bits:
1
High Level Input Current-Max:
0.00002 A
Input Characteristics:
DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type:
LINE TRANSCEIVER
Interface Standard:
V.11; EIA-422-A; TIA-422-A; EIA-485; TIA-485
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e0
Length:
4.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Out Swing-Min:
1.3 V
Output Low Current-Max:
0.016 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
235
Qualification Status:
Not Qualified
Receive Delay-Max:
90 ns
Receiver Number of Bits:
1
Seated Height-Max:
1.75 mm
Supply Current-Max:
75 mA
Supply Voltage-Max:
5.25 V
Supply Voltage-Min:
4.75 V
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Technology:
BIPOLAR
Temperature Grade:
INDUSTRIAL
Terminal Finish:
TIN LEAD
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
20
Transmit Delay-Max:
60 ns
Width:
3.9 mm
DS36277TMX Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the DS36277TMX datasheet (Section 10.1) and in the DS36277TMX Evaluation Module User's Guide. It's essential to follow these guidelines to minimize noise, ensure proper thermal management, and optimize signal integrity.
To minimize power consumption, set the device to the lowest possible frequency (e.g., 100 kHz) and adjust the output voltage to the minimum required level. Additionally, use the power-down mode (PD pin) when the device is not in use. Refer to the datasheet (Section 7.3) for more information on power management.
The DS36277TMX can drive up to 10 nF of capacitive load. Exceeding this limit may affect the device's stability and performance. If a higher capacitive load is required, consider adding a buffer or using a device with a higher drive capability.
To ensure EMC, follow proper PCB design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding or filtering components as needed. Additionally, consider using the device's built-in electromagnetic interference (EMI) filtering features, such as the internal 100 Ω output impedance.
The device has a thermal pad that must be connected to a thermal plane on the PCB to ensure proper heat dissipation. Use thermal vias or a thermal interface material (TIM) to improve heat transfer. The datasheet (Section 10.2) provides more information on thermal management.
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DS36277TMX Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
