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DS36C278TMX - Texas Instruments

Description: RS-422/RS-485 Interface IC Obsolete, LTB expires Aug-07-2018

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DS36C278TMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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DS36C278TMX - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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DS36C278TMX Details

  • Manufacturer Part Number:

    DS36C278TMX

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422-B; TIA-442-B; EIA-485

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.004 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    400 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transmit Delay-Max:

    80 ns

  • Width:

    3.9 mm

DS36C278TMX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines for clock and data signals.
  • To ensure reliable operation, it's crucial to follow the recommended operating conditions, including temperature, voltage, and current. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a stable temperature.
  • Operating the device at a lower clock frequency may reduce power consumption but can also impact performance. Conversely, using a higher clock frequency may improve performance but increases power consumption and may require additional thermal management. Consult the datasheet and application notes for specific guidance.
  • Follow the recommended power sequencing and voltage regulation guidelines in the datasheet. Ensure that the power supply can provide the required current and voltage, and consider using a low-dropout regulator (LDO) or a dedicated voltage regulator module (VRM) to maintain a stable voltage.
  • To maintain signal integrity, use controlled impedance traces, and terminate signals according to the datasheet recommendations. Consider using series termination resistors, parallel termination resistors, or active termination schemes, depending on the specific interface requirements.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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