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DS75176BM/NOPB - Texas Instruments

Description: IC,driver,bus,serial,RS-485,SO8,DS75176BM/NOPB

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DS75176BM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - CDCVF2505D
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DS75176BM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - CDCVF2505D
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DS75176BM/NOPB Details

  • Manufacturer Part Number:

    DS75176BM/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    37 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    22 ns

  • Width:

    3.9 mm

DS75176BM/NOPB Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
  • Using a lower voltage supply than recommended may result in reduced performance, increased power consumption, or even device malfunction. Using a higher voltage supply than recommended can lead to overheating, reduced lifespan, or even device failure. It is crucial to adhere to the recommended voltage supply range for optimal performance and reliability.
  • To troubleshoot issues related to signal integrity and jitter, use oscilloscopes or signal analyzers to measure signal quality, and verify that the device is properly terminated and matched to the transmission line. Also, ensure that the power supply is clean and stable, and that the device is operated within the recommended specifications.
  • The DS75176BM/NOPB has built-in ESD protection, but it is still essential to follow proper handling and assembly procedures to prevent damage. Additionally, ensure that the device is properly connected to a ground plane, and that the power supply is decoupled to prevent latch-up.

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DS75176BM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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