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DS75176BTM - Texas Instruments

Description: Transceiver

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DS75176BTM - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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DS75176BTM - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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DS75176BTM Details

  • Manufacturer Part Number:

    DS75176BTM

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    37 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    60.5 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transmit Delay-Max:

    22 ns

  • Width:

    3.9 mm

DS75176BTM Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane, separate power planes for analog and digital sections, and careful routing of high-speed signals is recommended. TI provides a reference design and layout guidelines in the datasheet and application notes.
  • Use the device's power-down modes, adjust the clock frequency, and optimize the output voltage and current settings. Additionally, consider using a low-dropout regulator (LDO) to minimize power consumption.
  • Ensure good airflow, use a heat sink if necessary, and follow TI's thermal design guidelines. The device is rated for operation up to 125°C, but thermal management is crucial to prevent overheating and ensure reliability.
  • Use TI's recommended debugging tools, such as logic analyzers and oscilloscopes, to analyze signals and identify issues. Consult the datasheet, application notes, and TI's support resources for guidance on troubleshooting common problems.
  • Yes, follow TI's guidelines for high-reliability and safety-critical applications, including using redundant systems, implementing error detection and correction, and following relevant industry standards and regulations.

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DS75176BTM Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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