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DS75176BTMX - Texas Instruments

Description: RS-422/RS-485 Interface IC Obsolete, LTB expires Aug-07-2018

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DS75176BTMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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DS75176BTMX - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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DS75176BTMX Details

  • Manufacturer Part Number:

    DS75176BTMX

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    37 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transmit Delay-Max:

    22 ns

  • Width:

    3.9 mm

DS75176BTMX Frequently Asked Questions (FAQs)

  • TI recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer to minimize thermal resistance.
  • Ensure proper thermal management, use a heat sink if necessary, and follow the recommended operating conditions and derating guidelines in the datasheet.
  • Use a shielded enclosure, keep signal traces short and away from the device, use a common-mode choke, and follow good PCB layout practices to minimize radiation.
  • Check the oscillator circuit for proper component values, ensure the crystal is properly connected, and verify the oscillator enable pin is properly configured.
  • Using a different crystal frequency may affect the device's accuracy, stability, and overall performance. Consult the datasheet and TI's application notes for guidance.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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