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DS90CF364AMTDX - Texas Instruments

Description: LVDS Interface IC A 926-D90CF364AMTDXNPB

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DS90CF364AMTDX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G**)
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DS90CF364AMTDX Details

  • Manufacturer Part Number:

    DS90CF364AMTDX

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    PLASTIC, TSSOP-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1998-10-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    NO

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e0

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    105 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    6.1 mm

DS90CF364AMTDX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90CF364AMTDX evaluation module (EVM) user's guide, which includes guidelines for component placement, routing, and thermal management.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions and thermal management guidelines in the datasheet, and consider using thermal interface materials and heat sinks as needed.
  • The maximum cable length supported by the DS90CF364AMTDX depends on the specific application and the type of cable used. As a general guideline, the device supports cable lengths up to 10 meters at 3.3 Gbps and up to 5 meters at 6 Gbps.
  • The DS90CF364AMTDX can be configured for different data rates and protocols using the device's registers and control pins. Refer to the datasheet and application notes for specific configuration guidelines and examples.
  • The DS90CF364AMTDX requires a specific power sequencing order to ensure reliable operation. The recommended power sequencing order is VCCIO, VCCA, and then VCCPLL, with a minimum delay of 10 ms between each power rail.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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