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DS90CF383MTDX/NOPB - Texas Instruments

Description: LVDS Interface IC 3.3V, 24-Bit FPD Link LVDS Transmitter

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DS90CF383MTDX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 56-Lead Molded Thin Shrink Small Outline Package
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DS90CF383MTDX/NOPB Details

  • Manufacturer Part Number:

    DS90CF383MTDX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    1997-06-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Differential Output:

    YES

  • Driver Number of Bits:

    5

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2.7 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90CF383MTDX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in their application note SLUA433, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal management guidelines in the datasheet, including providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range of -40°C to 105°C.
  • The DS90CF383MTDX/NOPB is a high-speed serializer, and as such, it can be a source of electromagnetic interference (EMI). To mitigate EMI issues, it is recommended to use proper shielding, grounding, and routing techniques, such as using shielded cables, grounding the device properly, and routing high-speed signals away from sensitive analog circuits.
  • Yes, the DS90CF383MTDX/NOPB can be used in a multi-drop bus configuration, but it requires careful consideration of the bus loading, signal integrity, and clock domain crossing issues. Texas Instruments provides guidelines for multi-drop bus configuration in their application note SLUA434.
  • To troubleshoot issues with the DS90CF383MTDX/NOPB, it is recommended to use a combination of tools, such as logic analyzers, oscilloscopes, and protocol analyzers, to capture and analyze the serialized data streams. Additionally, Texas Instruments provides a troubleshooting guide in their application note SLUA435, which includes a step-by-step approach to identifying and resolving common issues.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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