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DS90CR218AMTDX/NOPB - Texas Instruments

Description: LVDS Interface IC +3.3V Rising Edge Data Strobe LVDS 21-Bit Channel Link Receiver - 85 MHz 48-TSSOP -10 to 70

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DS90CR218AMTDX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A
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DS90CR218AMTDX/NOPB Details

  • Manufacturer Part Number:

    DS90CR218AMTDX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.000015 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Out Swing-Min:

    0.345 V

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    115 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90CR218AMTDX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90CR218A datasheet, which includes guidelines for trace routing, component placement, and thermal management. Additionally, TI offers a PCB layout checklist and a layout guide for FPD-Link III devices.
  • To ensure signal integrity and minimize EMI, follow the recommended PCB layout guidelines, use differential signaling, and implement proper shielding and grounding techniques. Additionally, use a common-mode filter and a shielded cable to reduce EMI. TI also provides a signal integrity guide for FPD-Link III devices.
  • The maximum cable length supported by the DS90CR218AMTDX/NOPB depends on the specific application and the type of cable used. However, as a general guideline, TI recommends a maximum cable length of 10 meters for FPD-Link III devices. Longer cable lengths may be possible with the use of repeaters or active cables.
  • The DS90CR218AMTDX/NOPB can be configured using the I2C interface or through the use of external resistors. TI provides a configuration guide and a register map in the datasheet, as well as a software development kit (SDK) for configuring and evaluating the device.
  • The power consumption of the DS90CR218AMTDX/NOPB depends on the specific application and the operating conditions. However, according to the datasheet, the typical power consumption is around 350 mW per channel. TI also provides a power consumption calculator tool to help estimate power consumption for specific designs.

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DS90CR218AMTDX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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