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DS90CR288MTDX/NOPB - Texas Instruments

Description: LVDS Interface IC

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DS90CR288MTDX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 56-Lead Molded Thin Shrink Small Outline Package
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DS90CR288MTDX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - 56-Lead Molded Thin Shrink Small Outline Package
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DS90CR288MTDX/NOPB Details

  • Manufacturer Part Number:

    DS90CR288MTDX/NOPB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP, TSSOP56,.3,20

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    5

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    130 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6.1 mm

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DS90CR288MTDX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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