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DS90LV019TMX - Texas Instruments

Description: LVDS Interface IC 3.3-V or 5-V LVDS driver and receiver 14-SOIC -40 to 85

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DS90LV019TMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - M14A
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DS90LV019TMX Details

  • Manufacturer Part Number:

    DS90LV019TMX

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    1998-06-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    CAN ALSO OPERATE WITH A 5V SUPPLY

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e0

  • Length:

    8.62 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    9 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.753 mm

  • Supply Current-Max:

    48 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transmit Delay-Max:

    7 ns

  • Width:

    3.9 mm

DS90LV019TMX Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the DS90LV019TMX is dependent on the clock frequency and the type of cable used. As a general guideline, Texas Instruments recommends a maximum cable length of 10 meters at 1.5 Gbps and 5 meters at 3 Gbps.
  • The DS90LV019TMX can be configured using the I2C interface. Texas Instruments provides a software development kit (SDK) that includes a GUI-based tool for configuring the device. The SDK also includes a programming guide and example code for popular microcontrollers.
  • The power consumption of the DS90LV019TMX varies depending on the operating mode and clock frequency. In typical operation, the device consumes around 250 mW at 1.5 Gbps and 400 mW at 3 Gbps. The device also has a low-power standby mode that consumes around 10 mW.
  • Yes, the DS90LV019TMX is compatible with other FPD-Link III devices from Texas Instruments. The device is designed to be backward compatible with previous generations of FPD-Link devices, and it can be used in systems that require interoperability with other FPD-Link III devices.
  • Texas Instruments provides a range of tools and resources for troubleshooting issues with the DS90LV019TMX, including a debugging guide, application notes, and a support forum. Engineers can also use the device's built-in diagnostic features, such as the loopback mode and the error detection and correction features, to identify and debug issues.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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