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DS90LV027AHMX/NOPB - Texas Instruments

Description: LVDS Driver 600Mbps 0.45V 8-Pin SOIC T/R

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PCB Footprints
DS90LV027AHMX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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DS90LV027AHMX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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DS90LV027AHMX/NOPB Details

  • Manufacturer Part Number:

    DS90LV027AHMX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2 ns

  • Width:

    3.9 mm

DS90LV027AHMX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90LV027A datasheet, which includes guidelines for trace routing, component placement, and thermal management. Additionally, TI offers a PCB layout checklist and a layout guide for FPD-Link III devices, which can be found on their website.
  • To ensure signal integrity, it's essential to follow proper PCB design and layout practices, such as using controlled impedance traces, minimizing signal reflections, and using termination resistors. Additionally, TI recommends using a common mode filter and a differential mode filter to reduce electromagnetic interference (EMI) and improve signal quality.
  • The maximum cable length supported by the DS90LV027AHMX/NOPB depends on the specific application and the type of cable used. However, TI recommends a maximum cable length of 10 meters for FPD-Link III devices. Longer cable lengths may be possible with the use of repeaters or active cables.
  • TI provides a troubleshooting guide for FPD-Link III devices, which includes steps for identifying and resolving common issues such as signal integrity problems, clock domain crossing issues, and power supply noise. Additionally, engineers can use tools such as oscilloscopes and logic analyzers to debug and analyze the signal transmission.
  • The DS90LV027AHMX/NOPB is a FPD-Link III device, which is compatible with other FPD-Link III devices. However, it's not compatible with FPD-Link II devices, which use a different protocol and have different pinouts. Engineers should ensure that all devices in the system are compatible and use the same protocol to ensure proper communication.

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DS90LV027AHMX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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