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DS90LV110ATMT - Texas Instruments

Description: 1:10 LVDS BUFFER, DS90LV110ATMT

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DS90LV110ATMT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW(R-PDSO-G28)
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DS90LV110ATMT - Texas Instruments  - 3D model - Small Outline Packages - PW(R-PDSO-G28)
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DS90LV110ATMT Details

  • Manufacturer Part Number:

    DS90LV110ATMT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Family:

    90LV

  • Input Conditioning:

    DIFFERENTIAL

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e0

  • Length:

    9.7 mm

  • Load Capacitance (CL):

    5 pF

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of True Outputs:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    235

  • Power Supply Current-Max (ICC):

    160 mA

  • Prop. Delay@Nom-Sup:

    3.9 ns

  • Propagation Delay (tpd):

    3.9 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.091 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    4.4 mm

DS90LV110ATMT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90LV110ATMT datasheet, which includes guidelines for component placement, routing, and thermal management. Additionally, TI offers a PCB layout checklist and a layout guide for FPD-Link III devices, which can be found on their website.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature ranges. Additionally, proper thermal management, such as heat sinking and airflow, is crucial to prevent overheating. TI also recommends using a thermal pad on the exposed pad of the device to improve heat dissipation.
  • When selecting the clock frequency, consider the required data rate, cable length, and system power consumption. The clock frequency should be chosen to ensure reliable data transmission and minimize electromagnetic interference (EMI). TI provides guidelines for clock frequency selection in the datasheet and application notes.
  • TI provides a troubleshooting guide for FPD-Link III devices, which includes steps to identify and resolve common issues. Additionally, engineers can use tools such as oscilloscopes and logic analyzers to debug the device and identify the root cause of the problem. TI also offers technical support and resources, such as the TI E2E forum, to help engineers troubleshoot and resolve issues.
  • In a system with multiple transmitters and receivers, it's essential to ensure that each device is properly synchronized and configured to prevent data transmission errors and EMI. TI recommends using a common clock source and following the guidelines for multi-transmitter and multi-receiver systems outlined in the datasheet and application notes.

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DS90LV110ATMT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image DS90LV110TMTC/NOPB National Semiconductor Corporation

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Part Image DS90LV110ATMT/NOPB National Semiconductor Corporation

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For a full list of alternate parts for DS90LV110ATMT, check out Findchips.com