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DS91C180TMA/NOPB - Texas Instruments

Description: 100 MHz M-LVDS Line Driver/Receiver Pair

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DS91C180TMA/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (-R-PDSO-G14)
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DS91C180TMA/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D (-R-PDSO-G14)
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DS91C180TMA/NOPB Details

  • Manufacturer Part Number:

    DS91C180TMA/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000015 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-899; TIA-899

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.48 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.000014999999999999999 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    7.5 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    29.5 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    5.5 ns

  • Width:

    3.9 mm

DS91C180TMA/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS91C180TMA/NOPB evaluation module documentation, which includes guidelines for component placement, routing, and thermal management. It's essential to follow these guidelines to ensure optimal performance, especially for high-speed signals and power supply decoupling.
  • Texas Instruments provides a troubleshooting guide in the DS91C180TMA/NOPB datasheet, which includes steps to identify and resolve common issues. Additionally, engineers can use tools like logic analyzers, oscilloscopes, and debug software to diagnose problems. It's also recommended to consult the TI E2E forum, where experts and community members can provide guidance and support.
  • The DS91C180TMA/NOPB has a maximum junction temperature of 150°C. To ensure reliable operation, engineers should implement proper thermal management techniques, such as using heat sinks, thermal interfaces, and airflow management. It's also essential to follow the recommended PCB layout and component placement guidelines to minimize thermal resistance and ensure efficient heat dissipation.
  • The DS91C180TMA/NOPB is not specifically designed or qualified for radiation-hardened or high-reliability applications. However, Texas Instruments offers other products that are designed and qualified for such applications, such as the RH1053 and RH1054. Engineers should consult the relevant datasheets and documentation to determine the suitability of these products for their specific application.
  • The DS91C180TMA/NOPB has built-in ESD protection and latch-up prevention mechanisms. However, engineers should still follow proper ESD handling and prevention techniques during manufacturing, assembly, and testing. Additionally, it's essential to follow the recommended PCB layout and component placement guidelines to minimize the risk of latch-up events.

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DS91C180TMA/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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