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DS92LV090ATVEHX/NOPB - Texas Instruments

Description: LVDS Interface IC 9 Channel Bus LVDS Transceiver 64-LQFP -40 to 85

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DS92LV090ATVEHX/NOPB - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - PM0064A
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DS92LV090ATVEHX/NOPB - Texas Instruments  - 3D model - Quad Flat Packages - PM0064A
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DS92LV090ATVEHX/NOPB Details

  • Manufacturer Part Number:

    DS92LV090ATVEHX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    9

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    9

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.24 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    3.2 ns

  • Receiver Number of Bits:

    9

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    210 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2.2 ns

  • Width:

    10 mm

DS92LV090ATVEHX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVA466, which includes guidelines for signal routing, power supply decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • To ensure reliable operation over the full industrial temperature range (-40°C to 85°C), it is essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly powered and decoupled. Additionally, consider using a thermal analysis tool to simulate the device's thermal performance and identify potential hotspots.
  • Operating the DS92LV090ATVEHX/NOPB at a lower voltage than the recommended 3.3V may result in reduced performance, increased power consumption, and potential reliability issues. Operating at a higher voltage may result in increased power consumption, heat generation, and potential damage to the device. It is recommended to operate the device within the specified voltage range to ensure optimal performance and reliability.
  • To troubleshoot signal integrity issues on the LVDS lanes, use a high-speed oscilloscope to capture the signal waveforms and analyze them for amplitude, jitter, and skew. Check the PCB layout for signal routing and termination issues, and ensure that the device is properly powered and decoupled. Additionally, consider using a signal integrity analysis tool to simulate the signal behavior and identify potential issues.
  • The DS92LV090ATVEHX/NOPB is a high-speed device that can generate electromagnetic interference (EMI) and radio-frequency interference (RFI). To minimize EMI and RFI, follow proper PCB design and layout guidelines, use shielding and grounding techniques, and ensure that the device is properly powered and decoupled. Additionally, consider using EMI and RFI shielding materials and components to reduce radiation and susceptibility.

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DS92LV090ATVEHX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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