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DS92LV1021AMSAX/NOPB - Texas Instruments

Description: LVDS Serializer 400Mbps 0.27V 28-Pin SSOP T/R

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DS92LV1021AMSAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G28)
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DS92LV1021AMSAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DB (R-PDSO-G28)
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DS92LV1021AMSAX/NOPB Details

  • Manufacturer Part Number:

    DS92LV1021AMSAX/NOPB

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.29 mm

DS92LV1021AMSAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. Additionally, it's recommended to use a common mode filter and to decouple the power supply with capacitors.
  • To ensure reliable operation in high-temperature environments, it's recommended to follow the thermal design guidelines provided by Texas Instruments, including using a heat sink and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range.
  • The recommended termination scheme for the DS92LV1021AMSAX/NOPB is a 100-ohm differential termination at the receiver end. This helps to minimize reflections and ensure reliable data transmission.
  • To troubleshoot issues with the DS92LV1021AMSAX/NOPB, it's recommended to use oscilloscopes and logic analyzers to analyze the signal waveforms and data transmission patterns. Additionally, checking the PCB layout and signal routing, as well as ensuring proper power supply decoupling, can help identify and resolve issues.
  • Yes, when designing with the DS92LV1021AMSAX/NOPB, it's important to consider EMI/EMC issues, such as radiated emissions and conducted emissions. Texas Instruments recommends following good EMI/EMC design practices, including using shielding, filtering, and grounding techniques to minimize electromagnetic interference.

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DS92LV1021AMSAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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