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DS92LV1212TMSA - Texas Instruments

Description: 10bit LVDS deserializer,DS92LV1212TMSA

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DS92LV1212TMSA - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - MSA28
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DS92LV1212TMSA - Texas Instruments  - 3D model - Small Outline Packages - MSA28
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DS92LV1212TMSA Details

  • Manufacturer Part Number:

    DS92LV1212TMSA

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    SEATED HGT-NOM

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e0

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.009 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    235

  • Receiver Number of Bits:

    10

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    5.29 mm

DS92LV1212TMSA Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the DS92LV1212TMSA is dependent on the specific application and the type of cable used. However, as a general guideline, Texas Instruments recommends a maximum cable length of 10 meters for FPD-Link III applications.
  • The DS92LV1212TMSA can be configured using the SPI interface. Texas Instruments provides a software development kit (SDK) that includes a GUI-based configuration tool, as well as API documentation and example code, to help engineers configure the device for their specific application.
  • The power consumption of the DS92LV1212TMSA varies depending on the operating mode and the frequency of operation. According to the datasheet, the typical power consumption is around 250 mW at 1.8V and 100 MHz. However, engineers should consult the datasheet and perform their own power consumption calculations based on their specific application requirements.
  • Yes, the DS92LV1212TMSA is compatible with other FPD-Link devices from Texas Instruments. It is designed to be backward compatible with previous generations of FPD-Link devices, and it can be used in conjunction with other FPD-Link devices to create a complete FPD-Link system.
  • The latency of the DS92LV1212TMSA is dependent on the specific application and the type of data being transmitted. However, according to the datasheet, the typical latency is around 10-20 clock cycles, which translates to around 100-200 ns at 100 MHz.

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DS92LV1212TMSA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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